Electronics Packaging Components

Packaged devices for electronics assembly continue to become smaller and require ever more precise production processes for the manufacture of their components. PRECISION MICRO is facilitating this change through the unique combination of manufacturing techniques it embraces.

In addition to precision lead frames, the Company manufactures a variety of stepped and plain flat lids for the hermetic sealing of ceramic packages and hybrid devices. Photo Etching produces high accuracy, burr free components that may be coated/plated to meet customer specifications.

Single-source supply:-

reduces administration
minimises lead times
reduces costs

Avaliable materials

Kovar
Alloy 42
Stainless Steel
Molybdenum

Available plating finishes

Gold
Nickel

Low-cost photo tooling:-

reduces lead times
allows design optimisation without financial penalty
helps realise a low risk entry stategy
makes short run, short life projects viable
low cost upgrades and changes

Ultra-high tolerances:-

guarantee optimum sealing properties