Laser Evolved Etching Process (LEEP) is the combination of precision Photo Etching with Advanced Laser Direct Imaging. This gives the process the capability to create highly accurate micro components, with fine features and high complexity, to exceptionally tight tolerances measured in microns.
The introduction of advanced LDI into the process route has also increased repeatability and as a consequence, is responsible for higher yields. The ability to eliminate photo tooling from the precision etching process also removes several potential sources of variance as well as speeding up the process.
Front to back feature alignment is exceptionally precise and the higher resolution exposure guarantees that edges are sharper and more precisely defined. The process is also capable of creating multi-level features in a single operation, through precise micro-patterning of the etch resist.
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LEEP is an exceptionally efficient method of producing profiled parts with surface micro features. It is now possible to create micro channels in the 25 microns range; features which were once only possible using more expensive micro laser or advanced electroforming techniques.
For further information call today on +44 (0)121 380 0100 or click here for your free Laser Enhanced Micromachining sample brochure pack |
