- Components & Features
- Component Features
- Component Applications
- -› Connectors & Contacts
- -› EMI / RFI Shielding
- -› Leadframes
- -› Electronics Packaging Components
- -› Frets & Harnesses
- -› Fuel Cell Plates
- -› Laminations
- -› Medical Implants, Needles & Instruments
- -› Meshes & Filters
- -› Microfluidic Components
- -› Microwave Components
- -› Optical Encoder Discs & Strips
- -› Printing Stencils & Foils
- -› Shims & Gaskets
- -› Springs
- -› Fotoboard 2®
- -› LEEF Multilayer Electroforming
- -› LEEF Micro Filters
- -› LEEF Optical Encoders
- -› LEEF Open Mesh
- -› LEEP Micro Forming
- -› LEEP Micro Channels
LEEP Micro Forming
Laser Evolved Etching Process can produce micro formed compoentns in most metals from 0.01mm thick.
Precision Micro utilise interchangeable, highly accurate tooling for all precision formed components.
Rapid prototyping to medium volume at an affordable cost.
For further details on Laser Evolved Etching Process please click here
